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芯片铜互连研究及进展

2021-03-01
芯片铜互连研究及进展

Copper Filling of 100 nm Trenches Using PEG, PPG, and a Triblock Copolymer as Plating Suppressors

2021-03-01
Copper Filling of 100 nm Trenches Using PEG, PPG, and a Triblock Copolymer as Plating Suppressors

芯片铜互连电镀添加剂浓度对镀层性能的影响

2021-03-01
芯片铜互连电镀添加剂浓度对镀层性能的影响

GLSI铜互连层CMP后碱性清洗液的研究

2021-03-01
GLSI铜互连层CMP后碱性清洗液的研究

KrF光刻胶浸酸残留缺陷的机理研究及解决方案

2021-03-01
KrF光刻胶浸酸残留缺陷的机理研究及解决方案

Acceleration Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper Electroplating

2021-03-01
Acceleration Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper Electroplating

基于阴离子表面活性剂的铜CMP后清洗新型碱性清洗液

2021-03-01
基于阴离子表面活性剂的铜CMP后清洗新型碱性清洗液

Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection

2021-03-01
Hydroquinone oriented growth control to achieve high-quality copper coating at high rate for electronics interconnection

深槽刻蚀工艺参数及干法清洗工艺的研究

2021-03-01
深槽刻蚀工艺参数及干法清洗工艺的研究

Review of recent advances in inorganic photoresists

2021-03-01
Review of recent advances in inorganic photoresists
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